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Figure 2 from Copper clip package for high performance MOSFETs and its optimization | Semantic Scholar
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Replacing wire bonds enhances automotive MOSFET performance and reliability | Toshiba Electronic Devices & Storage Corporation | Europe(EMEA)
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Figure 1 from Copper clip package for high performance MOSFETs and its optimization | Semantic Scholar
Cu Clip Bonding Method with Optimized Source Inductance for Current Balancing in Multichip SiC MOSFET Power Module
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Figure 2 from Copper clip package for high performance MOSFETs and its optimization | Semantic Scholar
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